preface xv part ⅰ history of electroless ting 1.history–from the discovery of electroless ting to the present 1.1 discovery of electroless ting 4 1.1.1 early works 4 1.1.2 brenner and riddell’s work 6 1.2 early stage of development（1940s–1959）9 1.2.1 research works 9 1.2.2 patents issued 10 1.2.3 preliminary applications 12 1.3 slow growth of period（1960–1979）12 1.3.1 improvement of the ting bath 13 1.3.2 various electroless ting metals 17 1.3.3 electroless ting cu 20 1.3.4 deition substrate 23 1.3.5 application 26 1.4 rapid development of period（1980–1999）26 1.4.1 studying the nature of electroless ting 26 1.4.2 studying the properties of electroless ting deits 27 1.4.3 large—scale application in many industries 31 1.4.4 investigation of ternary and multiponent alloys and ites 33 1.4.5 electroless ting began and developed rapidly in china 34 1.4.6 electroless ting fe–b based alloys have been proed and developed 35 1.5 in—depth development and nanoelectroless ting stage（2000–present）36 1.5.1 in—depth investigation of the mechanism and theory in electroless ting 38 1.5.2 rapid development of nanoelectroless ting 38 1.6 summary and prospect 39 references 40 part ⅱ technology of electroless ting—ting bath，critical parameters，deition rate，and stability of ting bath 2.electroless ting baths of metals，binary alloys，and multiponent alloys 2.1 general consideration for electroless ting bath solution 51 2.2 ting bath of electroless pure nickel and nickel—based binary alloys 53 2.2.1 pure ni and co metals 53 2.2.2 ni–p 53 2.2.3 ni–b 53 2.3 cobalt—based binary alloys 57 2.3.1 co–p 57 2.3.2 co–b 57 2.4 cu and copper—based binary alloys 58 2.5 au 58 2.6 ag 58 2.7 pd and palladium—based binary alloys 59 2.8 pt and tinum—based binary alloys 59 2.9 ru，rh，os，and cr–p binary alloys 59 2.10 group b metals（zn，cd，in，sn，pb，as，sb，and bi）and a few binary alloys of these metals 62 2.11 electroless ting of ternary alloys 67 2.11.1 ni–me–p alloy ting baths 67 2.11.2 co–me–p alloy ting baths 74 2.11.3 ni–me–b alloy ting baths 74 2.11.4 co–me–b alloy ting baths 74 2.11.5 other ternary alloy ting baths 89 2.12 electroless ting of quaternary alloys 90 2.12.1 ni—based quaternary alloy ting baths 90 2.12.2 co—based quaternary alloy ting baths 90 2.13 electroless ting quinary and multialloys 90 2.14 summary 90 references 100 3.electroless ite ting 3.1 general considerations about ecp 109 3.2 bath solutions of ecp 110 3.2.1 bath for binary alloy—based ecp 110 3.2.2 bath for ternary alloy—based ecp 113 3.2.3 bath for ecp with two kinds of particles 116 3.3 summary 116 references 138 4.nano electroless ting 4.1 bulk nano ep materials 144 4.1.1 nano ecp 144 4.1.2 ep three—dimensional nanostructured materials（3d nsms）163 4.22d nano ep materials 172 4.2.1 ep 2d nano films 173 4.2.2 ep 2d nanotes 181 4.2.3 ep 2d nanodisks 182 4.2.4 ep 2d nanoshells and nanosheets 183 4.2.5 ep 2d nanowalls 184 4.2.6 ep 2d nano circles and rings 185 4.2.7 ep 2d nanohoneyb 187 4.2.8 ep 2d nanoline，nanofi n pattern，and 2d nano grating 188 4.3 linear（1d）nano ep materials 191 4.3.1 ep nanotubes 191 4.3.2 ep nanowires 214 4.3.3 ep nanorods 240 4.3.4 ep nanobelts 246 4.4 zero—dimensional nano ep materials 250 4.4.1 ep nanoparticles 251 4.4.2 ep nanoparticle arrays 262 4.4.3 ep nanoparticles other than spherical shape 264 4.4.4 ep core—shell nanoparticles 268 4.5 summary 278 references 279 5.electroless ting fe—based alloys 5.1 why electroless ting fe–b alloys？ 291 5.2 discovery of ep fe–b alloys 292 5.2.1 the ting bath and affective parameters 294 5.2.2 analysis of the diffi culty in obtaining ep fe–b alloys 295 5.2.3 ition，structure，and properties of ep fe–b alloys 296 5.2.4 formation mechanism of ep fe–b alloys 303 5.2.5 problems and worthwhile improvements for ep fe–b alloys 304 5.3 ep binary fe–b alloys 305 5.4 ep fe–b—based multiponent alloys 307 5.4.1 ep fe–w–b alloy deits 308 5.4.2 ep fe–mo–b alloy deits 310 5.4.3 ep fe–sn–b alloy deits 312 5.4.4 ep fe–w–mo–b alloy deits 313 5.4.5 ep fe–ni–b alloy deits 315 5.5 ep fe–p alloys 315 5.6 ep fe–p—based ternary—ponent alloys 317 5.7 summary 319 references 319 6.impact parameters and deition rate 6.1 effects of ting bath ponents on deition rate 324 6.1.1 effect of metal salts 324 6.1.2 effect of reducing agent 334 6.1.3 the effect of pleng agent 337 6.1.4 effect of stabilizer 342 6.1.5 effect of accelerating agent 349 6.1.6 the effect of surfactants 352 6.2 effects of operating conditions 357 6.2.1 effect of ph value 357 6.2.2 effect of ting temperature 361 6.2.3 effect of ting time 362 6.3 effects of other technological parameters 364 6.3.1 effect of stirring 364 6.3.2 effect of magic field 372 6.3.3 effect of bath loa 373 6.4 summary 376 references 376 7.green electroless ting 7.1 what is green electroless ting？ 383 7.2 green electroless ting of en 384 7.3 green electroless ting on cu 390 7.3.1 hypophosphite 390 7.3.2 glyoxylic acid 393 7.3.3 dmab 395 7.3.4 sodium bisulfate 397 7.3.5 co2+and fe2+397 7.3.6 saccharide 400 7.3.7 green ligand for ep cu 400 7.4 green electroless ting ag 401 7.5 green electroless ting au 403 7.6 summary 406 references 406 part ⅲ ition，microscopic structure，and surface morphology of electroless deits 8.ition and microstructure 8.1 ition and microstructures of ep alloy deits 415 8.1.1 ni–p alloy deits 415 8.1.2 other ep binary deits 440 8.1.3 binary alloy—based ecp deits 449 8.2 ition and microstructures of ep ternary and multiponent alloy deits 451 8.2.1 effects of metal salts on ition and structure in ternary and quaternary alloy coatings 452 8.2.2 effects of reductant on ition and structure in ternary and quaternary
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